Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. What We Offer Location: Singapore,SGP You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits . As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects. Senior Member of Technical Staff (Advanced Packaging Pathfinding) This role is responsible for driving pathfinding and early-stage technology development for N+2 and beyond advanced packaging architectures as a senior individual contributor. The position focuses on disruptive innovation, deep technical problem-solving, and concept-to-feasibility execution, shaping future integration solutions and enabling new value creation opportunities. The SMTS will operate at the intersection of technology innovation, customer roadmaps, and ecosystem collaboration, translating emerging concepts into scalable, differentiated capabilities aligned with Applied Materials’ long-term strategy. Disruptive Pathfinding & Technology Development Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures. Lead hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes. Develop and validate new integration approaches (e.g., mixed interconnect architectures, advanced bumping strategies, next-gen substrates). Perform deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions. Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions. Technical Innovation & Execution Own key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution. Design and execute experiments, simulations, and test vehicles to validate new ideas and reduce technical risk. Develop scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements. Translate innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles. Document and communicate findings to influence technology roadmap decisions and downstream development programs. Customer & Market Alignment Engage with internal and external stakeholders to translate customer requirements and system trends (AI, HPC, memory integration, chiplets) into actionable technical problems. Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions. Contribute to value proposition development by linking technical innovation to performance, cost, and scalability benefits. Ecosystem Collaboration Work closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies. Support joint development efforts and early-stage collaborations, contributing technical expertise and insights. Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts. Program Contribution & Technical Leadership Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations. Influence cross-functional teams (process, product, integration) to align on technology direction and development priorities. Develop executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs. Mentor junior engineers and contribute to building technical depth and innovation culture within the team. Leadership Expectations Deep Technical Expert: Recognized for strong domain expertise in advanced packaging and integration. Innovation Driver: Generates and executes breakthrough ideas with measurable technical impact. Influencer: Drives alignment and decisions across teams without formal authority. Problem Solver: Thrives in ambiguity, breaking down complex challenges into actionable solutions. Collaborator: Effectively works across organizational and ecosystem boundaries. Core Qualifications 10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains. Demonstrated experience in technology development, pathfinding, or exploratory R&D. Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.). Proven ability to solve complex technical problems and translate concepts into experimental validation. Strong communication skills to articulate technical insights and business relevance. Preferred Qualifications Advanced degree (MS/PhD) in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related field. Experience in heterogeneous integration, chiplet architectures, or next-generation interconnect technologies. Track record of innovation (patents, publications, or first-of-a-kind solutions). Familiarity with design–process co-optimization and system-level trade-offs. Impact Enable next-generation advanced packaging innovations through hands-on technical leadership. Influence Applied Materials’ long-term packaging technology roadmap. Deliver differentiated technical capabilities that support future product platforms and customer engagements. Work Location Science Park II (Moving to Tampines in Dec 2026) Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 20% of the Time Relocation Eligible: Yes Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.